Solution38

Defect : Icicles

Process/machine infomation :

Board type - Single sided

Solderability protection - OSP

Flux carrier - Alcohol

Preheat type - Infrared

Process solutions

• Conveyor speed too slow.

  a. Time over preheat too long causing flux to be burned
  off.

  b. Dwell time too long causing flux to be destroyed before
  exiting the wave.

• Solder temperature too low.

• The use of nitrogen will prevent icicles.

• Not enough flux.

Board and design solutions

• Pad tied to power/ground plane without thermal
  relief.