Solution39

Defect : Bridging

Process/machine infomation :

Board type - Single sided

Solderability protection - OSP

Flux carrier - Alcohol

Preheat type - Infrared

Process solutions

• Conveyor speed too slow.

  a. Time over preheat too long causing flux to be burned
  off.

  b. Dwell time too long causing flux to be destroyed before
  exiting the wave.

• Topside board temp too low.

• Flux not active enough or solids percentage too
  low.

• Solder temperature too low.

• Use debridging knife to remove bridges.

• Not enough flux.

Board and design solutions

• Lead length too long.

• Lead length to pad size ratio incorrect.

• Component layout, orientation.

• Using solder thieves on inline connections will prevent
  bridging.

• Pad design/size.